| Component for |
Server/workstation |
| Data transfer rate |
6 Gbit/s |
| Depth |
100.1 mm |
| H/W PLP function |
Yes |
| Hardware encryption |
No |
| Height |
7 mm |
| Hot-Plug support |
Yes |
| Interface |
Serial ATA III |
| Master (outer) case gross weight |
959.95 g |
| Master (outer) case height |
69.8 mm |
| Master (outer) case length |
203.2 mm |
| Master (outer) case width |
135.9 mm |
| Mean time between failures (MTBF) |
2000000 h |
| memory type |
3D TLC NAND |
| Non-operating vibration |
20 G |
| Operating temperature (T-T) |
0 - 70 °C |
| Operating vibration |
2.17 G |
| package depth |
9.1 mm |
| package height |
184.2 mm |
| package weight |
88.19 g |
| package width |
129.5 mm |
| Power consumption (average) |
1.45 W |
| Power consumption (idle) |
1.3 W |
| Power consumption (read) |
1.6 W |
| Power consumption (write) |
3.6 W |
| Products per master (outer) case |
10 pc(s) |
| Random read (4KB) |
94000 IOPS |
| Random write (4KB) |
41000 IOPS |
| Read latency |
200 µs |
| Read speed |
560 MB/s |
| SSD capacity |
480 GB |
| SSD form factor |
2.5" |
| storage temperature (T-T) |
-40 - 85 °C |
| Target workload |
Mixed Use (MU) |
| TBW rating |
876 |
| Use conditions |
Server/Enterprise |
| weight |
66 g |
| Width |
69.8 mm |
| Write latency |
30 µs |
| Write speed |
470 MB/s |